SA15 TVS DIODE 15VWM 24.4VC DO15[FAQ]: Datasheet, Features, and Applications

UTMEL

Published: 09 March 2022 | Last Updated: 09 March 2022

398

SA15

SA15

Littelfuse Inc.

TVS DIODE 15V 25.62V DO204AC

Purchase Guide

TVS DIODE 15V 25.62V DO204AC

SA15 is a TVs Diodes. This article is going to introduce pinout, applications, features, and more details about SA15.

Overview of SA15

The SA15 was created to safeguard sensitive electronic equipment against voltage transients caused by lightning and other transient voltage phenomena.


SA15 Features

  • 500W peak pulsecapability  at 10/1000μswaveform, repetition rate (duty cycles):0.01%

  • VBR @ TJ= VBR  @25°Cx (1+αT x (TJ - 25)) (αT:Temperature Coefficient, typical value is 0.1%)

  • Glass passivated chipjunction  in DO-15 Package

  • Fast response time: typically less than 1.0psfrom 0 Volts to BV min

  • Excellent clamping capability 

  • The typical failure mode is short from over-specified voltage or current

  • Whisker test is conducted based on JEDECJESD201A  per its table 4a and 4c

  • IEC-61000-4-2 ESD  30kV(Air), 30kV (Contact)

  • ESD protection of data lines in accordance with IEC  61000-4-2

  • EFT protection of data lines in accordance with IEC  61000-4-4

  • Low incremental surge resistance

  • Typical IR  less than 1μAwhen VBR  max>13V

  • High temperatureto reflow solderingguaranteed: 260°C/40sec/ 0.375”,(9.5mm) lead length, 5 lbs., (2.3kg) tension

  • Plastic package is flammability rated V-0 peer underwriters Laboratories

  • Matte tin lead–free plated

  • Halogen-free and RoHS  -compliant

  • Pb-free E3 means 2ndlevel interconnect is free and the terminal finish material is tin(Sn) (IPC/JEDEC J-STD609A.01)


Specifications

Littelfuse Inc. SA15 technical specifications, attributes, parameters and parts with similar specifications to Littelfuse Inc. SA15.
  • Type
    Parameter
  • Factory Lead Time
    19 Weeks
  • Mount

    In electronic components, the term "Mount" typically refers to the method or process of physically attaching or fixing a component onto a circuit board or other electronic device. This can involve soldering, adhesive bonding, or other techniques to secure the component in place. The mounting process is crucial for ensuring proper electrical connections and mechanical stability within the electronic system. Different components may have specific mounting requirements based on their size, shape, and function, and manufacturers provide guidelines for proper mounting procedures to ensure optimal performance and reliability of the electronic device.

    Through Hole
  • Mounting Type

    The "Mounting Type" in electronic components refers to the method used to attach or connect a component to a circuit board or other substrate, such as through-hole, surface-mount, or panel mount.

    Through Hole
  • Package / Case

    refers to the protective housing that encases an electronic component, providing mechanical support, electrical connections, and thermal management.

    DO-204AC, DO-15, Axial
  • Diode Element Material

    The parameter "Diode Element Material" refers to the specific semiconductor material used in the construction of a diode. This material determines the electrical characteristics and performance of the diode, including its forward voltage drop, reverse breakdown voltage, and switching speed. Common diode element materials include silicon, germanium, and gallium arsenide, each offering different advantages for various applications. The choice of material impacts the diode's efficiency, thermal stability, and overall suitability for specific electronic circuits.

    SILICON
  • Breakdown Voltage / V
    16.7V
  • Number of Elements
    1
  • Reverse Stand-off Voltage
    15V
  • Operating Temperature

    The operating temperature is the range of ambient temperature within which a power supply, or any other electrical equipment, operate in. This ranges from a minimum operating temperature, to a peak or maximum operating temperature, outside which, the power supply may fail.

    -55°C~175°C TJ
  • Packaging

    Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

    Tape & Reel (TR)
  • Series

    In electronic components, the "Series" refers to a group of products that share similar characteristics, designs, or functionalities, often produced by the same manufacturer. These components within a series typically have common specifications but may vary in terms of voltage, power, or packaging to meet different application needs. The series name helps identify and differentiate between various product lines within a manufacturer's catalog.

    SA
  • JESD-609 Code

    The "JESD-609 Code" in electronic components refers to a standardized marking code that indicates the lead-free solder composition and finish of electronic components for compliance with environmental regulations.

    e3
  • Pbfree Code

    The "Pbfree Code" parameter in electronic components refers to the code or marking used to indicate that the component is lead-free. Lead (Pb) is a toxic substance that has been widely used in electronic components for many years, but due to environmental concerns, there has been a shift towards lead-free alternatives. The Pbfree Code helps manufacturers and users easily identify components that do not contain lead, ensuring compliance with regulations and promoting environmentally friendly practices. It is important to pay attention to the Pbfree Code when selecting electronic components to ensure they meet the necessary requirements for lead-free applications.

    no
  • Part Status

    Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

    Active
  • Moisture Sensitivity Level (MSL)

    Moisture Sensitivity Level (MSL) is a standardized rating that indicates the susceptibility of electronic components, particularly semiconductors, to moisture-induced damage during storage and the soldering process, defining the allowable exposure time to ambient conditions before they require special handling or baking to prevent failures

    1 (Unlimited)
  • Number of Terminations
    2
  • Termination

    Termination in electronic components refers to the practice of matching the impedance of a circuit to prevent signal reflections and ensure maximum power transfer. It involves the use of resistors or other components at the end of transmission lines or connections. Proper termination is crucial in high-frequency applications to maintain signal integrity and reduce noise.

    Axial
  • ECCN Code

    An ECCN (Export Control Classification Number) is an alphanumeric code used by the U.S. Bureau of Industry and Security to identify and categorize electronic components and other dual-use items that may require an export license based on their technical characteristics and potential for military use.

    EAR99
  • Type
    Zener
  • Terminal Finish

    Terminal Finish refers to the surface treatment applied to the terminals or leads of electronic components to enhance their performance and longevity. It can improve solderability, corrosion resistance, and overall reliability of the connection in electronic assemblies. Common finishes include nickel, gold, and tin, each possessing distinct properties suitable for various applications. The choice of terminal finish can significantly impact the durability and effectiveness of electronic devices.

    Matte Tin (Sn)
  • Applications

    The parameter "Applications" in electronic components refers to the specific uses or functions for which a component is designed. It encompasses various fields such as consumer electronics, industrial automation, telecommunications, automotive, and medical devices. Understanding the applications helps in selecting the right components for a particular design based on performance, reliability, and compatibility requirements. This parameter also guides manufacturers in targeting their products to relevant markets and customer needs.

    General Purpose
  • Additional Feature

    Any Feature, including a modified Existing Feature, that is not an Existing Feature.

    EXCELLENT CLAMPING CAPABILITY
  • Power Rating

    The "Power Rating" of an electronic component refers to the maximum amount of power that the component can handle or dissipate without being damaged. It is typically measured in watts and is an important specification to consider when designing or selecting components for a circuit. Exceeding the power rating of a component can lead to overheating, malfunction, or even permanent damage. It is crucial to ensure that the power rating of each component in a circuit is sufficient to handle the power levels expected during normal operation to maintain the reliability and longevity of the electronic system.

    500W
  • Voltage - Rated DC

    Voltage - Rated DC is a parameter that specifies the maximum direct current (DC) voltage that an electronic component can safely handle without being damaged. This rating is crucial for ensuring the proper functioning and longevity of the component in a circuit. Exceeding the rated DC voltage can lead to overheating, breakdown, or even permanent damage to the component. It is important to carefully consider this parameter when designing or selecting components for a circuit to prevent any potential issues related to voltage overload.

    15V
  • Terminal Form

    Occurring at or forming the end of a series, succession, or the like; closing; concluding.

    WIRE
  • Peak Reflow Temperature (Cel)

    Peak Reflow Temperature (Cel) is a parameter that specifies the maximum temperature at which an electronic component can be exposed during the reflow soldering process. Reflow soldering is a common method used to attach electronic components to a circuit board. The Peak Reflow Temperature is crucial because it ensures that the component is not damaged or degraded during the soldering process. Exceeding the specified Peak Reflow Temperature can lead to issues such as component failure, reduced performance, or even permanent damage to the component. It is important for manufacturers and assemblers to adhere to the recommended Peak Reflow Temperature to ensure the reliability and functionality of the electronic components.

    260
  • Time@Peak Reflow Temperature-Max (s)

    Time@Peak Reflow Temperature-Max (s) refers to the maximum duration that an electronic component can be exposed to the peak reflow temperature during the soldering process, which is crucial for ensuring reliable solder joint formation without damaging the component.

    30
  • JESD-30 Code

    JESD-30 Code refers to a standardized descriptive designation system established by JEDEC for semiconductor-device packages. This system provides a systematic method for generating designators that convey essential information about the package's physical characteristics, such as size and shape, which aids in component identification and selection. By using JESD-30 codes, manufacturers and engineers can ensure consistency and clarity in the specification of semiconductor packages across various applications and industries.

    O-PALF-W2
  • Operating Supply Voltage

    The voltage level by which an electrical system is designated and to which certain operating characteristics of the system are related.

    15V
  • Polarity

    In electronic components, polarity refers to the orientation or direction in which the component must be connected in a circuit to function properly. Components such as diodes, capacitors, and LEDs have polarity markings to indicate which terminal should be connected to the positive or negative side of the circuit. Connecting a component with incorrect polarity can lead to malfunction or damage. It is important to pay attention to polarity markings and follow the manufacturer's instructions to ensure proper operation of electronic components.

    Unidirectional
  • Configuration

    The parameter "Configuration" in electronic components refers to the specific arrangement or setup of the components within a circuit or system. It encompasses how individual elements are interconnected and their physical layout. Configuration can affect the functionality, performance, and efficiency of the electronic system, and may influence factors such as signal flow, impedance, and power distribution. Understanding the configuration is essential for design, troubleshooting, and optimizing electronic devices.

    SINGLE
  • Case Connection

    Case Connection refers to the method by which an electronic component's case or housing is connected to the electrical circuit. This connection is important for grounding purposes, mechanical stability, and heat dissipation. The case connection can vary depending on the type of component and its intended application. It is crucial to ensure a secure and reliable case connection to maintain the overall performance and safety of the electronic device.

    ISOLATED
  • Power Line Protection

    During fault, the only circuit breaker closest to the fault point should be tripped. The operating time of relay associated with protection of line should be as minimum as possible in order to prevent unnecessary tripping of circuit breakers associated with other healthy parts of power system.

    No
  • Voltage - Breakdown (Min)

    Voltage - Breakdown (Min) is a parameter used to specify the minimum voltage level at which an electronic component, such as a diode or capacitor, will break down and allow current to flow through it uncontrollably. This breakdown voltage is a critical characteristic that determines the maximum voltage the component can withstand before failing. It is important to ensure that the applied voltage does not exceed this minimum breakdown voltage to prevent damage to the component and maintain proper functionality. Manufacturers provide this specification to help engineers and designers select components that are suitable for their intended applications and operating conditions.

    15.84V
  • Clamping Voltage

    Clamping voltage is a term used in electronic components, particularly in devices like diodes and transient voltage suppressors. It refers to the maximum voltage level at which the component can effectively limit or clamp the voltage across its terminals. When the voltage across the component exceeds the clamping voltage, the component conducts and effectively limits the voltage to that level, protecting the circuit from overvoltage conditions. Clamping voltage is an important parameter to consider when selecting components for applications where voltage spikes or surges may occur, as it determines the level at which the component will start to protect the circuit.

    25.62V
  • Peak Pulse Current

    The peak pulse power rating of a TVS diode is defined as the instantaneous power dissipated by a device for a given pulse condition, and is a measure of the power that is dissipated in the TVS junction during a given transient event.

    20.9A
  • Max Surge Current

    Surge current is a peak non repetitive current. Maximum (peak or surge) forward current = IFSM or if(surge), the maximum peak amount of current the diode is able to conduct in forward bias mode.

    20.9A
  • Peak Pulse Power

    Peak Pulse Power is a parameter used to specify the maximum amount of power that an electronic component can handle during a transient event, such as a surge or spike in voltage or current. It indicates the maximum power dissipation capability of the component for a short duration. This parameter is important for protecting electronic circuits from damage caused by sudden high-energy events. Peak Pulse Power is typically expressed in watts and is crucial for selecting components that can withstand transient overloads without failing. It helps ensure the reliability and longevity of electronic systems in various applications.

    500W
  • Number of Unidirectional Channels
    1
  • Diameter

    In electronic components, the parameter "Diameter" typically refers to the measurement of the width of a circular component, such as a resistor, capacitor, or inductor. It is a crucial dimension that helps determine the physical size and fit of the component within a circuit or on a circuit board. The diameter is usually measured in millimeters (mm) or inches (in) and is important for ensuring proper placement and soldering of the component during assembly. Understanding the diameter of electronic components is essential for selecting the right size for a specific application and ensuring compatibility with other components and the overall design of the circuit.

    3.6mm
  • Length
    7.6mm
  • RoHS Status

    RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

    ROHS3 Compliant
  • Lead Free

    Lead Free is a term used to describe electronic components that do not contain lead as part of their composition. Lead is a toxic material that can have harmful effects on human health and the environment, so the electronics industry has been moving towards lead-free components to reduce these risks. Lead-free components are typically made using alternative materials such as silver, copper, and tin. Manufacturers must comply with regulations such as the Restriction of Hazardous Substances (RoHS) directive to ensure that their products are lead-free and environmentally friendly.

    Lead Free
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SA15 Functional Diagram

SA15 Functional Diagram.jpg

SA15 Functional Diagram


SA15 Dimensions

SA15 Dimensions.jpg

SA15 Dimensions

DimensionsInches
MinMaxMinMax
A1_25.4_
B0.230.35.87.6
C0.0280.0340.710.86
D0.1040.142.63.6



SA15 Maximum Ratings and Thermal Characteristics

ParameterSymbolValue Unit
Peak Pulse Power Dissipation by
10/1000μs Test Waveform
PPPM500W
Steady-State Power Dissipation on
Infinite Heat Sink at TL
=75ºC 
PD3W
Peak Forward Surge Current, 8.3ms
Single Half Sine Wave Unidirectional
Only 


FSM
70A
Maximum Instantaneous Forward Voltage at 35A for Unidirectional
Only 
VF3.5V
Operating Junction and Storage
Temperature Range
TJ, TSTG -65 to 175 °C
Typical Thermal Resistance Junction
to Lead
RθJL20°C/W
Typical Thermal Resistance Junction
to Ambient
RθJA75°C/W


Parts with Similar Specs

SA15 Applications

  • Home and smart appliances

  • Display time and digital combination

  • Industrial and instrumental applications

  • Numeric status


SA15 Package information

SA15 Package information.jpg

SA15 Package information


SA15 Manufacturer

Littelfuse products are used in a wide range of electrical energy-related applications, from consumer gadgets to cars and industrial buildings. With rising platforms in power regulation and sense, they have the industry's broadest and deepest array of circuit protection devices. As part of their corporate strategy of accelerated organic expansion and strategic acquisitions, they are growing into complimentary markets. Power semiconductors, heavy-duty switches, magnetic, optical, electromechanical, and temperature sensors, as well as equipment for the safe regulation and distribution of electrical power, are among these markets.


Datasheet PDF

Download datasheets and manufacturer documentation for Littelfuse Inc. SA15.

Popularity by Region

Frequently Asked Questions

How many pins of SA15 ?

2 pins.

What’s the operating temperature of SA15 ?

-55°C~175°C TJ.

What’s the packaging way of SA15 ?

Tape & Reel (TR).

What’s the Operating Supply Voltage of SA15 ?

15V.

What’s the Breakdown Voltage of SA15 ?

16.7V.

What’s the Diameter of SA15 ?

3.6mm.
SA15

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